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  4. Synthesis and Characterization of Creep Resistant Sn-Cu-Y2O3 Nanocomposite Lead-Free Solder Synthesis and Characterization...
Please use this identifier to cite or link to this item: http://www.idr.iitkgp.ac.in/xmlui/handle/123456789/8063
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dc.contributor.authorMallik, Manila-
dc.date.accessioned2017-08-01T10:12:24Z-
dc.date.available2017-08-01T10:12:24Z-
dc.date.issued2017-06-01-
dc.identifier.govdocNB15758-
dc.identifier.urihttp://www.idr.iitkgp.ac.in/xmlui/handle/123456789/8063-
dc.language.isoenen
dc.publisherIIT, Kharagpuren
dc.subjectImpression Creepen
dc.subjectAccumulative Forgingen
dc.subjectNanoindentation Creepen
dc.subjectNanocompositeen
dc.subjectLead Free Solderen
dc.titleProf. Rabindra Nath Ghosh and Prof. Siddhartha Dasen
dc.typeThesisen
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