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  4. Copper Matrix Nanocomposite Coating for Electrical Contact Application by Pulse Reverse Electrodeposition
Please use this identifier to cite or link to this item: http://www.idr.iitkgp.ac.in/xmlui/handle/123456789/3722
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dc.contributor.authorPradhan, Ajaya Kumar
dc.date.accessioned2015-04-24T11:13:26Z
dc.date.available2015-04-24T11:13:26Z
dc.date.issued2014
dc.identifier.govdocNB14986
dc.identifier.urihttp://www.idr.iitkgp.ac.in/xmlui/handle/123456789/3722
dc.language.isoenen
dc.publisherIndian Institute of Technology, Kharagpuren
dc.subjectELECTRODEPOSITIONen
dc.subjectNANOCOMPOSITEen
dc.subjectCOPPER MATRIXen
dc.titleCopper Matrix Nanocomposite Coating For Electrical Contact Application By Pulse Reverse Electrodepositionen
dc.typeThesisen
Appears in Collections:Copper Matrix Nanocomposite Coating for Electrical Contact Application by Pulse Reverse Electrodeposition

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