Please use this identifier to cite or link to this item: http://www.idr.iitkgp.ac.in/xmlui/handle/123456789/2623
Title: Development of Thick Film YIG Paste and Studies on Reciprocal and Nonreciprocal MIC Components
Authors: KAL, SANTIRAM
Keywords: Reproducibility
Hybrid integrated circuits
Thick film techniques
Microelectronics
Integrated Circuits
Evaporation
Vacuum deposited film
Substrate
Sputtering
Technological strides
Minaturized
Microwave components
Microstrip transmission
Issue Date: Nov-1983
Publisher: IIT Kharagpur
Gov't Doc #: NB11216
URI: http://www.idr.iitkgp.ac.in/xmlui/handle/123456789/2623
Appears in Collections:Development of Thick Film YIG Paste and Studies on Reciprocal and Nonreciprocal MIC Components

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