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  4. Development of Thick Film YIG Paste and Studies on Reciprocal and Nonreciprocal MIC Components
Please use this identifier to cite or link to this item: http://www.idr.iitkgp.ac.in/xmlui/handle/123456789/2623
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dc.contributor.authorKAL, SANTIRAM
dc.date.accessioned2014-09-11T10:04:01Z
dc.date.available2014-09-11T10:04:01Z
dc.date.issued1983-11
dc.identifier.govdocNB11216
dc.identifier.urihttp://www.idr.iitkgp.ac.in/xmlui/handle/123456789/2623
dc.language.isoenen
dc.publisherIIT Kharagpuren
dc.subjectReproducibilityen
dc.subjectHybrid integrated circuitsen
dc.subjectThick film techniquesen
dc.subjectMicroelectronicsen
dc.subjectIntegrated Circuitsen
dc.subjectEvaporationen
dc.subjectVacuum deposited filmen
dc.subjectSubstrateen
dc.subjectSputteringen
dc.subjectTechnological stridesen
dc.subjectMinaturizeden
dc.subjectMicrowave componentsen
dc.subjectMicrostrip transmissionen
dc.titleDevelopment of Thick Film YIG Paste and Studies on Reciprocal and Nonreciprocal MIC Componentsen
dc.typeThesisen
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