Please use this identifier to cite or link to this item: http://www.idr.iitkgp.ac.in/xmlui/handle/123456789/14761
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dc.contributor.authorBera, Kousik-
dc.date.accessioned2024-07-09T06:04:59Z-
dc.date.available2024-07-09T06:04:59Z-
dc.date.issued2023-05-
dc.identifier.govdocNB18059-
dc.identifier.urihttp://www.idr.iitkgp.ac.in/xmlui/handle/123456789/14761-
dc.language.isoenen_US
dc.publisherIIT Kharagpuren_US
dc.subjectHexagonal Boron Nitrideen_US
dc.subjectRaman Scatteringen_US
dc.subjectWrinkleen_US
dc.subjectStrainen_US
dc.subjectThermal Conductivityen_US
dc.titleStrain Distribution and Thermal Response in Wafer-scale Thin Films of Hexagonal Boron Nitrideen_US
dc.typeThesisen_US
Appears in Collections:Strain Distribution and Thermal Response in Wafer-scale Thin Films of Hexagonal Boron Nitride

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