Development of Thick Film YIG Paste and Studies on Reciprocal and Nonreciprocal MIC Components

dc.contributor.author	KAL, SANTIRAM
dc.date.accessioned	2014-09-11T10:04:01Z
dc.date.available	2014-09-11T10:04:01Z
dc.date.issued	1983-11
dc.identifier.govdoc	NB11216
dc.identifier.uri	http://www.idr.iitkgp.ac.in/xmlui/handle/123456789/2623
dc.language.iso	en	en
dc.publisher	IIT Kharagpur	en
dc.subject	Reproducibility	en
dc.subject	Hybrid integrated circuits	en
dc.subject	Thick film techniques	en
dc.subject	Microelectronics	en
dc.subject	Integrated Circuits	en
dc.subject	Evaporation	en
dc.subject	Vacuum deposited film	en
dc.subject	Substrate	en
dc.subject	Sputtering	en
dc.subject	Technological strides	en
dc.subject	Minaturized	en
dc.subject	Microwave components	en
dc.subject	Microstrip transmission	en
dc.title	Development of Thick Film YIG Paste and Studies on Reciprocal and Nonreciprocal MIC Components	en
dc.type	Thesis	en