<?xml version="1.0" encoding="UTF-8"?><rdf:RDF xmlns="http://purl.org/rss/1.0/" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:dc="http://purl.org/dc/elements/1.1/">
<channel rdf:about="http://127.0.0.1/xmlui/handle/123456789/545">
<title>Creep Behavior of Hot Rolled Powder Metallurgy Processed Al-SiCp Composites</title>
<link>http://127.0.0.1/xmlui/handle/123456789/545</link>
<description/>
<items>
<rdf:Seq>
<rdf:li rdf:resource="http://127.0.0.1/xmlui/handle/123456789/546"/>
</rdf:Seq>
</items>
<dc:date>2026-04-26T10:33:15Z</dc:date>
</channel>
<item rdf:about="http://127.0.0.1/xmlui/handle/123456789/546">
<title>Creep Behavior of Hot Rolled Powder Metallurgy Processed Al-SiCp Composites</title>
<link>http://127.0.0.1/xmlui/handle/123456789/546</link>
<description>Creep Behavior of Hot Rolled Powder Metallurgy Processed Al-SiCp Composites
Pal, Sharmilee
The structure-property relations and creep behavior of powder metallurgy&#13;
processed and hot rolled commercially pure Al and its composites with 5, 10, 15 and&#13;
20 vol.% SiC particulate reinforcements, have been studied. The results of uninterrupted&#13;
tests at 623 K under a stress of 21 MPa show the presence of distinct primary, secondary&#13;
and tertiary stages of creep. Both the creep resistance and Young’s moduli of the&#13;
composites are deteriorated with increase in particulate volume fraction due to cracking&#13;
and debonding of SiC particles during rolling. The stress exponents for both Al and Al-&#13;
SiCp composites, determined using stress jump tests at 623 K, are found to be between 4&#13;
and 5, suggesting the predominance of dislocation creep. The creep threshold stress has&#13;
been found as ≤ 3 MPa, which is attributed to back stress and detachment stress caused&#13;
by interactions of dislocations with Al2O3 and Fe-rich dispersoids present in both pure Al&#13;
and Al-SiCp composites. The activation energy estimated from temperature change tests&#13;
at 11 and 21 MPa is reasonably close to that for grain boundary and lattice self diffusion&#13;
of Al at low and high stresses, respectively. Pure Al and Al-5 or 10 volume percent SiC&#13;
particulate composites, has been also evaluated after subjecting to 0, 2 and 8 thermal&#13;
cycles between 773 and 273 K with rapid quenching.
</description>
<dc:date>2009-01-01T00:00:00Z</dc:date>
</item>
</rdf:RDF>
