<?xml version="1.0" encoding="UTF-8"?><feed xmlns="http://www.w3.org/2005/Atom" xmlns:dc="http://purl.org/dc/elements/1.1/">
<title>Strain Distribution and Thermal Response in Wafer-scale Thin Films of Hexagonal Boron Nitride</title>
<link href="http://127.0.0.1/xmlui/handle/123456789/14760" rel="alternate"/>
<subtitle/>
<id>http://127.0.0.1/xmlui/handle/123456789/14760</id>
<updated>2026-04-18T13:18:05Z</updated>
<dc:date>2026-04-18T13:18:05Z</dc:date>
<entry>
<title>Strain Distribution and Thermal Response in Wafer-scale Thin Films of Hexagonal Boron Nitride</title>
<link href="http://127.0.0.1/xmlui/handle/123456789/14761" rel="alternate"/>
<author>
<name>Bera, Kousik</name>
</author>
<id>http://127.0.0.1/xmlui/handle/123456789/14761</id>
<updated>2024-07-09T06:05:52Z</updated>
<published>2023-05-01T00:00:00Z</published>
<summary type="text">Strain Distribution and Thermal Response in Wafer-scale Thin Films of Hexagonal Boron Nitride
Bera, Kousik
</summary>
<dc:date>2023-05-01T00:00:00Z</dc:date>
</entry>
</feed>
